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IntraCu® Additives*

IntraCu® Additives*

Take Advanced Packaging to a completely new level

Umicore´s business unit Electroplating have partnered with SHINHAO Materials to provide innovative patented additives* for copper electroplating into the advanced packaging industry.

IntraCu®* as a modular Copper electroplating additive system embodies an integral part of our joint product offering. It is manufactured in state-of-the-art clean room environment to meet quality standards of the semiconductor industry.

IntraCu®* additives can be seen as a POR replacement for Microbumps in IC packages, RDL in wafer level packaging and Pillar in flip-chip packaging.

 

* Not available in Europe

 

Advantages

  • Bamboo-like structure
  • Matte Cu, Ra < 0.2 μm
  • Flat topography
  • Stable tensile strength
  • Resistant to grain growth
  • Resistant to etching
  • Bright Cu, Ra < 0.03 μm
  • ±50% process window for Cu pillar and RDL
  • Total in-film organics < 11 ppm
  • Excellent KV-less performance

Applications

  • Fine line RDL (< 2 μm)
  • Cu-to-Cu direct bonding
  • 2-in-1 bright Cu (Cu pillar and RDL)
  • 2-in-1 with KV-less requirement

Downloads

  • Produktblatt_IntraCu_Additives_EN.pdf

Your contact person

Markus Legeler

Markus Legeler

Manager Sales International
T: +49 7171 607 204
F: +49 7171 607 316
Email

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