IntraCu® Additives*

Take Advanced Packaging to a completely new level

Umicore´s business unit Electroplating have partnered with SHINHAO Materials to provide innovative patented additives* for copper electroplating into the advanced packaging industry.

IntraCu®* as a modular Copper electroplating additive system embodies an integral part of our joint product offering. It is manufactured in state-of-the-art clean room environment to meet quality standards of the semiconductor industry.

IntraCu®* additives can be seen as a POR replacement for Microbumps in IC packages, RDL in wafer level packaging and Pillar in flip-chip packaging.

_{* Not available in Europe}

Advantages

• Bamboo-like structure
• Matte Cu, Ra < 0.2 μm
• Flat topography
• Stable tensile strength
• Resistant to grain growth
• Resistant to etching
• Bright Cu, Ra < 0.03 μm
• ±50% process window for Cu pillar and RDL
• Total in-film organics < 11 ppm
• Excellent KV-less performance

Applications

• Fine line RDL (< 2 μm)
• Cu-to-Cu direct bonding
• 2-in-1 bright Cu (Cu pillar and RDL)
• 2-in-1 with KV-less requirement